Hi All,

I would be interested to find out why you are looking for specs on labels
for programmed ICs.  We are currently having problems
placing programmed ICs with labels.  It looks like the label reduces the
vacuum if the label is place such that the edge is across the nozzle which
causes pickup problems.  Also for those parts where this is not a problem
the label material itself is so smooth that when the nozzle rotates for
placement the part actually rotates on the nozzle.  Are these the problems
others are seeing?


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