Hi,

In this method ordinary through -hole components are soldered using reflow.
There are small annular rings around every pin to be soldered.
Solder paste is deposited on and outside the annular ring and the capillary
action of the smolten solder draws it to the lead.

Plastic used in bodies of components must stand the reflow temperature.

Intrusive reflow allows soldering of high density and self-nesting
interconnects
without secondary operations such as hand soldering.

Brs, Johannes


***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************