Tin Whiskers are most common with Sn plating or unfused SnPb Plating. Reflow of the SnPb or alloying of the Sn are the best options. As i recall, plating stresses and temperature increase the number of SnPb whiskers,. with eutectic solder you shouldn't be seeing them unless you have some strange environmental conditions , Jim Herard IBM Microelectronics Endicott ---------------------- Forwarded by Jim Herard/Endicott/IBM on 05-28-97 05:44 PM --------------------------- Tuan300859 @ aol.com 05-28-97 05:08 PM Please respond to [log in to unmask] @ internet To: technet @ ipc.org @ internet cc: Subject: Tin Whisker From: Tuan300859 Currently, I have observed some boards with Tin Whiskers growth. The whiskers seem to grow from the Tin-lead pads(unusual). The phenomenon is occurred at only one side of the QFP180 component on the board. Here are my questions: 1. What is/are the root cause(s) of the Tin Whisker? 2. Are there experiments or tests that had been done? 3. If no to both questions above, Are there any literature that I can read up to help determine the root causes of the Whisker? Thank you in advance *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * *************************************************************************** *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************