Hello, everyone I am working with sequential built up technology using photo imagebale dielectric to form micro vias. In pcb industry, dry film photo resists are used to tent the vias for copper etching. In our lab, we don't have dry film resists available at the moment. I have to spin liquid resists to do the copper etching. My question is, does anybody there know which kind of liquid resists fits this job to cover the side walls of the vias (40 micron deep) suixin zhang ELIS-TFCG/IMEC, University of Gent Sint-Pietersnieuwstraat 41, B-9000 Gent, Belgium tel: 0032-9-2643371 fax: 0032-9-2643594 Email: [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************