Richard, I've never used the test you describe; it sounds like a complex way to test something like adhesion. Most folks use the old "tape test" in one form or another. Some people make a cross-hatch cut in the resist and pull tape from that area, while others just lay tape across traces and pull. Either way, it's a pretty subjective test. Variables like differences in tape adhesive and the amount of force used to pull the tape make this test little more than an indicator of adhesion. The test you refer to is probably a little more scientific. Why do you want to measure adhesion? Resist should stick to the layers through develop and etch. If it doesn't, you have a problem. This may sound silly, or simplistic, but adhesion as a process control is difficult to quantify. Better to focus your attention on surface preparation, lamination parameters, and exposure. These are the areas that affect resist adhesion the most, and good controls here will ensure no adhesion problems. If you are having a problem, or would like to discuss this further, please contact me. Mark Dowding Regional Technical Specialist Insulectro 909-943-5758 [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************