Hello everyone I have a question about landless vias. If pattern plating is used to metallize the via walls and the top interconnection traces, the plated tin/lead will protect the via walls during the following copper etching processing. But if panel plating is uesd to do the metallization, how can dry film or liquid form photo resist keep the via walls from being attacked during the copper etching processing? As some extent of mis-alignment between a via pattern and the associated trace pattern is surely unavoidable, this will expose part of a via wall to the etchant. Any input to my question will be greatly appreciated. suixin zhang ELIS-TFCG/IMEC, University of Ghent Sint-Pietersnieuwstraat 41, B-9000 Ghent, Belgium tel: 0032-9-2643371 fax: 0032-9-2643594 Email: [log in to unmask] http://www.elis.rug.ac.be/ELISgroups/tfcg/staff/sz.html *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************