Hello TechNetters, I am a bare board fabricator and writing on behalf of one of our customers. They are having a solderability problem with one of the components, a press-fit pin, and are seeking any advice I can collect. These pins are .028" diameter and are pushed through .062" thick PC-75 laminate until just .010" protrudes out the other side, and held in place by friction. The .010" stub of the pin is surrounded by a pad to which solder paste is conventionally applied and flowed. After soldering, inspection shows excellent wetting of the pad surface, but *no bond to the pin*. Specifics of the pin materials are not available at this time, but visually they appear to be tin- coated brass. Mechanical scraping/brushing of the pin and hand soldering fixes the problem, they obviously want to avoid this in production. Personally, I think that the pin is being coated with resin as it is press fit through the hole wall (this is not a plated-through-hole board). Can anyone shed some light on this problem? Thanks! Bill Parlin *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************