Reply to: RE>>what is a flip chip? Hi, Flip refers to the fact that the chip is flipped - if you wirebond a chip (aka die) in a package, the pads are up. If you solder bump the pads and flip it to interconnect to the next level, it's a flip chip. The difference between a flip chip and a BGA is the material to which the balls (bumps) are attached. In the case of a BGA, the balls are attached to a substrate (plastic for PBGA, ceramic for CBGA, tape for TBGA, etc.). In the case of the flip chip, the solder bumps are attached to the silicon chip (die). For a complete description, visit: http://www.flipchip.com Regards, Charles Elliott Newbridge Networks [log in to unmask] -------------------------------------- Date: 1997.04.09 2:36 PM To: Charles Elliott From: Tom Johnson IPC-T-50 definition: Flip Chip "A leadless monolithic, circuit element structure that electrically and mechanically interconnects to a base material through the use of conductive bumps". Doesn't make much sense to me. Sounds like a BGA (Ball Grid Array). Thanks ---------- From: Dave Willhard[SMTP:[log in to unmask]] Sent: Wednesday, April 09, 1997 11:11 AM To: [log in to unmask] Subject: what is a flip chip? Everyone - What is a "flip chip"? I work in the PCB fabrication industry and see this term a lot in magazine articles. I've never heard the basic definition. Please help me increase my knowledge base. Thanks *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * *************************************************************************** *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * *************************************************************************** ------------------ RFC822 Header Follows ------------------ Received: by qmail.ca.newbridge.com with ADMIN;9 Apr 1997 14:13:07 -0400 Received: (from smap@localhost) by kanmaster.ca.newbridge.com (8.6.12/8.6.12) id OAA03299 for <[log in to unmask]>; Wed, 9 Apr 1997 14:12:23 -0400 Received: from kanata-gw.ca.newbridge.com(138.120.49.2) by kanmaster.ca.newbridge.com via smap (V1.3) id sma003255; Wed Apr 9 14:11:48 1997 Received: from ns.newbridge.com ([192.75.23.67]) by kanata-gw.ca.newbridge.com via smtpd (for kanmaster.ca.newbridge.com [138.120.124.4]) with SMTP; 9 Apr 1997 18:11:47 UT Received: (from smap@localhost) by ns.newbridge.com (8.6.12/8.6.12) id OAA20882 for <[log in to unmask]>; Wed, 9 Apr 1997 14:11:41 -0400 Received: from unknown(168.113.24.64) by ns.newbridge.com via smap (V1.3) id sma020648; Wed Apr 9 14:11:02 1997 Received: from ipc.org by simon.ipc.org via SMTP (940816.SGI.8.6.9/940406.SGI) id MAA19666; Wed, 9 Apr 1997 12:46:34 -0700 Resent-Date: Wed, 9 Apr 1997 12:46:34 -0700 Received: by ipc.org (Smail3.1.28.1 #2) id m0wF10z-000Bj7C; Wed, 9 Apr 97 12:18 CDT Resent-Sender: [log in to unmask] Old-Return-Path: <[log in to unmask]> Message-ID: <[log in to unmask]> From: Tom Johnson <[log in to unmask]> To: "[log in to unmask]" <[log in to unmask]>, "'Dave Willhard'" <[log in to unmask]> Subject: RE: what is a flip chip? Date: Wed, 9 Apr 1997 10:27:51 -0700 MIME-Version: 1.0 Content-Type: text/plain; charset="us-ascii" Content-Transfer-Encoding: quoted-printable Resent-Message-ID: <"UjTdI1.0.g3J.bzyIp"@ipc> Resent-From: [log in to unmask] X-Mailing-List: <[log in to unmask]> archive/latest/11809 X-Loop: [log in to unmask] Precedence: list Resent-Sender: [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************