Glenn, Have you tried increasing the bend radius to be at least equall to the pin thickness? That's a standard that seems to work well in some similar applications. Larry Morse Celwave RF ---------- ------------------------ INTERNET MAIL ------------------------ From: [log in to unmask] Subject: ASSY: Pin Fracture Date: Tue, 25 Mar 97 14:28:45 PST --------------------------------------------------------------------------- Technet, We are using an S-lead pin on some parts and recently noticed a fracture in the tin coating and into the base metal. We're fairly confident this is a result of the forming operation. The pin is 7-mil thick and formed on a 5-mil radius with Beryllium-Copper base metal and tin coating. The current amount of solder does not flow high enough to fill in the crack. We know this a reliability risk and are looking at options. What are some other things that could be done to prevent the fracture from propagating or oxidation of the copper from occurring? We have some ideas, one of which is to change the pin. Any suggestions will be greatly appreciated. Glenn Pelkey Quality/Reliability Engineer Maxtek Components Corp. (503) 627-2084 *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************