A vendor of ours has suggested that we use electroless gold/nickel on our
PWB/PCB's.  We
have fine pitch surface mount and thru-hole technology on our boards. They
suggest a gold
thickness of .1 um.  Is this thick enough?  How controlled is the process
to hold to .1 um
thickness?  What is the "ultimate" thickness?

Best Regards,

Mike Forrester
LeCroy Corp.
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