We are doing surface mount semiconductor assembly. After solder plating process the products goes to Trimming/Forming followed by Final Electrical testing. One of the problem we face is 'Contact' problem. The product leads are connected to electrical circuits (we call it Test blade) for the test. Once each product unit complete the test it will move to next process. Another product unit will be connected again and so on...This process take very short period of time. Few product units are tested in a second. Thousands of products are continousely ON and OFF going to this Test blade. Sometime the test blade can last for few days before getting dirty. Then we can either clean or change it. Sometime the test blade can only last for few hours! When we analyse this fast dirty test blade, we found black solder layer. It should be Tin/lead oxide build up.Some theory says, if the 'contact' between test blade and product leads are not good it can create a 'spark' and burn the solder very fast. The question is, what is the factors that affect the test blade life or how to slow down the solder build up? Is it Tin/lead composition, humidity or temperature ? regards M_Misri *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************