Hi Dennis, Calibrating the oven controls does not do it, you need to profile with test PCAs. I am not sure what relevance ISO and or military calibration standards have with regards to the proper profiling of solder reflow ovens. In any case, you need to use appropriate representative test PCAs properly instrumented with thermocouples to measure the temperature at the most critical locations, i.e. solder joints on the largest components with the greatest thermal mass which are likely to heat up the slowest. The profil needs to assure that even the slowest heating solder joint will reflow and wet every time. You may also have a thermocouple on a PWB surface pad to measure the maximum temperature reached by the PWB which is important fot PTH/PTV reliability. Werner Engelmaier Engelmaier Associates, Inc. Electronic Packaging, Interconnection and Reliability Consulting 23 Gunther Street Mendham, NJ 07945 USA Phone & Fax: 201-543-2747 E-mail: [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************