Looking for options & suggestions regarding how to improve wettability of Pd-Ag terminated parts using eutectic, water soluable, organic acid resin, convection reflow solder process. Current SMT Process: Alpha WS609 solderpaste / conv. reflow / hot DI water wash I have a board designed with varistors that are supposedly only available with Palladium-Silver terminations. The standard process results in unacceptable yields due to poor wettability. Options/Ideas so far: PROs CONs ------------------------- --------------------- ---------------------- Change solderpaste alloy better wetting extra process Modify reflow profile better wetting none Different atmosphere better wetting extra cost Solder dip terminations better wetting extra cost Are there any other suggestions or comments about ways to improve wettability? Can anyone recommend an inexpensive supplier to solder dip the parts? Thanks in advance for your comments. *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************