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From: "TOM BRESNAN" <[log in to unmask]>
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Subject: Re[2]: Pulse plating of copper and tin/lead
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Another option would be to panel plate, then print and etch the outer
layers (assuming HASL or other finish)
______________________________ Reply Separator _________________________________
Subject: Re: Pulse plating of copper and tin/lead
Author: [log in to unmask] at INTERNET_GATEWAY
Date: 3/19/97 3:57 PM
>I am working to resolve a problem in pattern plating a panel which has a ground
>plane on one side (40% plated panel area) and pads on the back side (6% plated
>panel area). We use modern DC rectifiers, one for each side, which share the
>cathode connection. The panels overplate the back (6%) side even with the
>corresponding rectifier turned off. Our only solution was to place current
>robbers on the back side which are selectively etched off in a later operation.
>I have been given information that "pulse plating" could allow us to plate this
>design with out any modifications to the plating areas. My question is:
>
>1. Does anyone currently use "pulse plating" in a pattern plating operation?
>2. Would this technology make plating this type of unbalanced design easier?
>
>
>Thanks, Rick Haynes
> Texas Instruments Printed Circuit Resources
> 512-250-7823 [log in to unmask]
>
Hi Rick,
Have you thought of panel plating the copper and then imaging to pattern
plate the tin-lead. We do this on some unplateable designs and it solved
the problem completely.
Paul Gould
Teknacron Circuits Ltd
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