De: Coderre - JCCODERR BRMVM1 ************************************************************* UNCLASSIFIED UNLESS OTHERWISE SPECIFIED Objet: Gold Thickness on Pads As a solderable finish, immersion gold over a nickel is suitable. Immersion gold is a self-limiting process whereby the plating stops when ion-exchange can no longer occur. This is typically in the 0.1 micron range.When components are soldered, all the gold is dissolved in the solder, the joint is made with the nickel....Gold embrittlement is a concern but should not be a problem when the gold content in the solder is maintained below 2% (some will claim 3%, others 4%). This will translate in thicknesses in the micron range, well above the maximum attainable thickness obtainable with an immersion system. Hence the self-controling nature of this surface finish. Hope this helps. Please call or e-mail if additionnal information is needed. Merci/Regards OEM Products and New Business Opportunities Dept 881/23 BRMT (tel. 514-534-6591) [log in to unmask] *** R(c)acheminement de la note de SMTP2 --IINUS1 03/13/97 12:57 ***