We are considering use of silver-filled vias for some via-in-SMD land applications. These would be through hole vias on .062" thru .200" thick boards, where the vias need to be topped over and plugged from one side only. Who has experience with this and what vias finished hole sizes work best? Thank you. Regards, Karl Sauter Sun Microsystems, Inc. 408 276-5499 *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************