Hello Techneters, Is there any difference between these 2 finishing methods as far as solderability is concerned ? We use multilayer boards ( up to 14 layers, densely populated with up to 19 BGA`s on a board. I am concerned about this issue. Maybe Immersion Gold would have been the best choice ? How about conductivity in via´s (IC-testing ) ? Thanks in advance. Every comments are highly appreciated. Brs [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************