Hello Techneters,



Is there any difference between these 2 finishing methods as far as
solderability is concerned ? We use multilayer boards ( up to 14 layers,
densely populated with up to 19 BGA`s on a board. I am concerned about
this issue. Maybe Immersion Gold would have been the best choice ?


How about conductivity in via´s (IC-testing ) ?

Thanks in advance. Every comments are highly appreciated.
Brs

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