DAVE, THE ARTICLE IS AN "OLD" ONE... CIRCUITS MANUFACTURING; MARCH 1978.. THE ARTICLE IS BASED ON A REPORT GIVEN BY KRISTI JAMES (MOTOROLA) IN IEEE TRANSACTIONS ON PARTS, HYBRIDS AND PACKAGING, DEC. 1977.. MAURY ROSENFIELD HARRIS SEMICONDUCTOR ______________________________ Reply Separator _________________________________ Subject: Re[2]: Aluminum wire bond to silver component Author: "ddhillma" <[log in to unmask]> at smtp Date: 2/20/97 11:44 AM Hi! What paper reference are you referring to? (I would like to track down a copy). Dave Hillman Rockwell Collins [log in to unmask] ______________________________ Reply Separator _________________________________ Subject: Re: Aluminum wire bond to silver component Author: [log in to unmask] at ccmgw1 Date: 2/20/97 10:36 AM THE COMMON PRACTICE IN THE IC WORLD OF PLASTIC PACKAGING IS THE USE OF GOLD WIRE WITH SILVER PLATED FRAMES.. ALUMINUM WIRE IS TYPICALLY USED WITH GOLD, ALUMINUM, AND NICKEL.. A PAPER WAS PUBLISHED YEARS AGO ON BONDING ALUMINUM TO SILVER PLATED SURFACES.. THE RESULTS SHOWED SEVERE BOND STRENGTH DEGRADATION AND BOND FAILURE DURING HUMIDITY TESTING. FAILURE MODE SHIFTED FROM WIRE BREAKS TO BOND LIFTS AS A RESULT OF ALUMINUM CORROSION. ______________________________ Reply Separator _________________________________ Subject: Aluminum wire bond to silver component Author: [log in to unmask] at smtp Date: 2/18/97 05:52 PM A vendor of mine attempted to wire bond using aluminum wire to a component with silver leads. This seems to have resulted in an unstable circuit due to poor bond connections. The circuit is a precision oscillator that is very sensative to phase noise and frequency shifts. We have seen that bonds have been failing bond pull at very low levels (.6g to 1.6g) and that multiple attempts have to be made to get any bonds to stick at all (11 attempts to get 2 bonds, both of which failed at under 2.6g). Q: What are the risks and problems associated with using aluminum wire bonds to a silver contact? *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * *************************************************************************** *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * *************************************************************************** *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************