Hi Wesley, On the prototypes we simply made the castellations non-solderable for the L5 (flip-chip-like) solder connections, in higher quantities we ordered them from Kyocera without catellation metalisation. If you use high-melt solder balls, ie. BGA, than you do not have to worry about the castellation stealing the solder, because the HMSBs woyuld not melt and maintain the solder joint height. You got some reply from Mark Spitnale and he is right, however LCC's made without a .008 or larger spacing under Mil-STD 2000A required essentially matched CTEs for components and substrate to assure reliable solder attachments. Werner Engelmaier Engelmaier Associates, Inc. Electronic Packaging, Interconnection and Reliability Consulting 23 Gunther Street Mendham, NJ 07945 USA Phone & Fax: 201-543-2747 E-mail: [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************