Werner, you are quite correct to begin investigation of the new high density PWB microvia technologies - sometimes referred to as "Sequential Build Up" SBU or "Build Up Multilayer" BUM boards. These approaches are rapidly moving from the laboratory into production. The Members of the Interconnection Technology Research Institute (ITRI) have been working on these technologies for several years and currently have projects underway to evaluate and implement all of the variations you mention. Technical reports are available on our results to-date. Please e-mail me if you are interested in the reports or would like further information. Marshall Andrews [log in to unmask] *************************************************************** Hi to all, I am working in the "Physical Board Design" Dept. and responsible for PCB and Boardtechnology. Now I like to start investigations for the new upcoming Chip scale packaging technology. I am looking especially for new and further requirements to realize this all for new PCB-technologies. - DYCOstrate ??? - Micro Vias ??? - Laser-drilling ??? - New Build Up technology ??? Is there anyone in the world who has experience in this area, or is working on this topic??? Any input will be appreciated, Thanks for the help in advance -- Werner Wiemers email: [log in to unmask] SNI OEC ES DB 3 Tel.: +49 5251 820386 Physical Board Design Fax: +49 5251 831087 PCB- and Boardtechnology Intranet: http://fozzy.pdb.sni.de/workarea/board_1 Heinz-Nixdorf-Ring 1 D-33106 Paderborn Germany *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************