Greetings All. I have a customer who is starting to place BGA's on his pcbs using an in-house developed CAD system. He has the BGA footprint specs from the part suppliers but lacks the knowledge/experience to optimize the pcb for assembly of these devices. He is looking for specs which will help him to properly design his boards to accept BGA devices-- and additionally, any special requirements which might be necessary for the various types of BGA devices (column vs ball). Any suggestions? Glynn Shaw, President Proto Engineering Corp. 181 Commercial St. Sunnyvale, Ca. 94086 email: [log in to unmask] phone: (408)738-0693 fax: (408)738-1290 modem: (408)738-1388 *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************