I have a question with regard to Resin Recession prior to thermal stress. Both IPC-600 and 6012 only indicate an acceptable condition after thermal stress. There is no mention of the acceptability of resin recession after HASL. I am looking to find any information which I could supply to one of my accounts that would indicate what the criteria would be prior to thermal stress. MIL-P-55110 paragraph 3.6.2.1.10.1 has a criteria prior to thermal stress. This product is also in excess of 175 mils thick. We have also recently moved to aprox. 175 degrees C,Tg material to alleviate lifted lands but we are now seeing more resin recession. Would someone at TechNet or IPC be able to comment on their views or findings for Resin Recession prior to thermal stress? *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************