"SLC" is an IBM developed BUM (built up multilayer) process which utilizes a photo-via technology. "PhotoLink" is also a BUM technology using a CIBA curtain-coated liquid photo-via technology produced by Continental Circuits, Inc. in Florida. Another BUM technology utilizes a thin, glass free resin coated copper with vias either laser or plasma ablated. Kevin R. Thomas AlliedSignal Laminate Systems MicroVia Materials Product Manager Ph : 608.791.2288 E-mail : [log in to unmask] SLC and Photolink are commercially available Built-up Multilayer (BUM) products , also known as Sequential Build-Up (SBU), boards. SLC and Photolink are both using photo-via technology. >>>From: [log in to unmask] >>>To: [log in to unmask] >>>Subject: Built-up Up Multilayer >>>Date: Thursday, February 06, 1997 8:32PM >>> >>> >>>Technet- >>>What are the differences between "SLC", "Photolink" and "BUM". Are >>>there differences in design / material ? >>> >>>*************************************************************************** >>>* TechNet mail list is provided as a service by IPC using SmartList v3.05 * >>>*************************************************************************** >>>* To unsubscribe from this list at any time, send a message to: * >>>* [log in to unmask] with <subject: unsubscribe> and no text. * >>>*************************************************************************** >>>* If you are having a problem with the IPC TechNet forum please contact * >>>* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * >>>*************************************************************************** >>> *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************