Hi Wesley,
At Bell Labs we removed the metallization in the castellations, the LCC swims
up like a flip-chip; that is how BGAs got started. You can also use high-melt
solder balls to get the 8-mil solder joint height. 

Werner Engelmaier
Engelmaier Associates, Inc.
Electronic Packaging, Interconnection and Reliability Consulting
23 Gunther Street
Mendham, NJ  07945  USA
Phone & Fax: 201-543-2747
E-mail: [log in to unmask]

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