We are in the business of manufacturing multilayer PCBs and have manufactured a few (trial run) PCBs for BGA, COB & FlipChip substrates. We would like to know about the Standards, Specifications, Proceedings, any other technical references,etc for inhouse reliability testing implementation. We request you to send the necessary details / documents / references pertaining to the above subject. With best regards, EDMUND SING. *************************************************************************** * ChipNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** * If you are having a problem with the IPC ChipNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************