Kevin, I thought 35/35 and 35/25 are the "standard" resin thickness. Do you also supply 50/50 or 35/50 regularly? BTW, is 0.25 oz. copper avaiable without significant price increase? Mason Hu Zycon Corporation ______________________________ Reply Separator _________________________________ Subject: RE: FAB:Laser vias Author: [log in to unmask] at corp Date: 2/19/97 3:53 AM David - Independent of whether the resin coated copper is B-stage only or C-stage/B-stage, you are correct to assume that in order to encapsulate the innerlayer circuitry - if it's one ounce (35 micron) copper - you should have two mils (50 microns) of resin. Less resin is necessary to cover one-half ounce (18 micron) circuitry. Several different thicknesses from 35 microns to 100 microns are currently commercially available of both B-stage only or C-stage/B-stage materials. Kevin R. Thomas MicroVia Materials Product Manager AlliedSignal Laminate Systems 608.791.2288 ---------- >>>From: David Arivett >>>To: [log in to unmask] >>>Subject: FAB:Laser vias >>>Date: Saturday, February 15, 1997 12:54PM >>> >>> >>> >>> >>> An article in the February edition of PCFAB talks about laser drilled >>>micro-vias. It shows a multi-layer stack-up of two cores with pre preg in >>>the center. The outer layers are formed with resin coated foil. My question >>>is: how thick is the resin on the foil? I am sure it must be at least 2 >>>mils >>>in order to have enough resin to encapsulate the inner layer circuitry. >>>What >>>is the maximum it might be? >>> >>>David Arivett >>>Cuplex Inc. >>> >>>*************************************************************************** >>>* TechNet mail list is provided as a service by IPC using SmartList v3.05 * >>>*************************************************************************** >>>* To subscribe/unsubscribe send a message <to: [log in to unmask]> * >>>* with <subject: subscribe/unsubscribe> and no text in the body. * >>>*************************************************************************** >>>* If you are having a problem with the IPC TechNet forum please contact * >>>* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * >>>*************************************************************************** >>> >>> *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * *************************************************************************** *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************