The soldering alloy we used here at Unisys, Roseville, MN was the 58% bismuth and 42% tin eutectic. The melting temperature is 281 deg. F. We used it for soldering a .300 thick, 50-layer board. We used this low temperature solder to reduce Z-axis expansion of this extremely thick board. Nick Wander Printed Circuit Engineering Unisys, Roseville, MN. ---------- From: [log in to unmask][SMTP:[log in to unmask]] Sent: Friday, January 24, 1997 2:38 PM To: [log in to unmask] Subject: Re: Reflow Soldering of PTH Connectors Gabe- Dave Hillman pretty much summed it up. In general, alloys with Bismuth (which allows for lower melting and liquidus temperatures, do tend to be relatively brittle (as compared to good ol' SnPb. However, in view of the reliability data, your application may be okay. A number of years ago, if I recall correctly, Unisys (Roseville) was using a SnPbBi alloy but the reliability was ample for their application. My main contact in that (now defunct) group was Mike Buseman who is now with MSL in Roseville, MN. You might try to reach him or Don Burr (who I believe is still with Unisys-Roseville) for further details. Phil Zarrow ITM, Inc. [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************