In a message dated 97-01-14 12:56:25 EST, you write: << I would like to know if anyone has any reliability information on the TSOP and PLCC at 120 degrees F., to 150 degrees F, during the life of the assembled board. Michael Cussen [log in to unmask] 1-810-477-3900-3306>> Michael, To my knowledge, there is no test or field assembly reliability data available in the range 48C to 66C. If there is, I'd be interested in seeing it. However, there is data for larger delta Ts (e.g., see reliability books by Lau et al.) which you then need to extrapolate to your own conditions. PLCCs have rather compliant leads so solder fatigue due to global CTE mismatch (component to board) will be relatively small and you need a model/acceleration factor that accounts for LOCAL CTE mismatch (between solder, board and package lead). This is even more significant with Alloy 42 TSOPs (see TechNet archives for previous discussions on Alloy 42 TSOP solder cracking). Jean-Paul ________________________________________________________________ Jean-Paul Clech EPSI Inc., P. O. Box 1522, Montclair, NJ 07042 - USA tel: +1 (201)746-3796 fax: + 1 (201)655-0815 Home page: <A HREF="http://members.aol.com/Epsiinc1/index.html">http://members .aol.com/Epsiinc1/index.html</A> - click above, or copy: http://members.aol.com/Epsiinc1/index.html __________________________________________________________________ *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************