ICT, a 24-hour burn-in, and a functional test after burn-in would typically not show you a fractured solder joint, because solder joint failures are almost always intermittent and only show up when disturbed mechanically (vibration) or thermally (heating or cooling). Insufficient solder is also not your likely problem--I would guess it is inadequate wetting, for whatever reason. Since you talk about a fine-pitch component, it is likely large; temperature profiling of large components during reflow has shown them to lag behind the PWB and smaller components by as much as 20C at peak reflow. Your solder joint may never have reached temperatures high enough to assure consistent good wetting. Werner Engelmaier Engelmaier Associates, Inc. Electronic Packaging, Interconnection and Reliability Consulting 23 Gunther Street Mendham, NJ 07945 USA Phone & Fax: 201-543-2747 E-mail: [log in to unmask]