Good Morning, Recently a customer had a field failure in which and internal circuit trace burned through. After a failure analysis was done, a cross-section determined that at the point of failure there was a dish-down or vertical thinning of the trace. This defect was not picked up at innerlayer inspection as the primary focus is on shorts, breaks and mouse-bites. The customer would like to know if there is any industry data showing the possible frequency of such a defect. How do I give a cause/corrective action for a defect Im not sure I can consistantly detect? Thank you for your help. Brett Austin Nationwide Circuits Inc *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************