For testing you should use IPC-SM-785, 'Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachments'. But it is quite likely that a reliability analysis as per IPC-D-279, 'Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies' or ANSI/IPC J-STD-013, 'Implementation of Ball Grid Array and Other High Density Technology' will give you a good enough indication of reliability to avoid accelerated testing, which frequently is done improperly because of time and resource constraints, all together. I will give a workshop "Practical Design and Prediction Methods for Surface Mount Solder Joint Reliability" at NEPCON West dealing with 'Design for Reliability' and testing issues. Werner Engelmaier Engelmaier Associates, Inc. Electronic Packaging, Interconnection and Reliability Consulting 23 Gunther Street Mendham, NJ 07945 USA Phone & Fax: 201-543-2747 E-mail: [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************