Text item: Sanjay, I can only help in your first inquiry. I had an excellent reference on QFP a while back. This was a packaging databook for Cirrus Logic parts (100 pin, 208 pin, etc.) and was JEDEC and others compliant -I don't think IPC gets into package coplanarities!! You can start from there. If you don't get quicker responses from technet, call Cirrus up. The area code there is 510. They are in Fremont (pronounced Freemont, I could never figure why!) Hope this helps. bilal ______________________________ Reply Separator _________________________________ Subject: GEN: Lead Coplanarity Spec?? Author: [log in to unmask] at SMTPGATE Date: 1/22/97 10:53 AM Technetters: I have a couple of questions and would appreciate any input... 1. What is the JEDEC/IPC spec on lead coplanarity for QFP's? 2. Can anyone recommend any tinning houses that would tin surface mount packages for us? I know one such place is Corfin, are there any other popular ones? Thank you ________________________________________________ Sanjay Rajan RF Communications Division Harris Corporation Product Design Engineering 1680 University Avenue Phone: (716) 242-3923 Rochester, NY 14610 Fax: (716) 242-3174 ________________________________________________ *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * *************************************************************************** Text item: External Message Header The following mail header is for administrative use and may be ignored unless there are problems. ***IF THERE ARE PROBLEMS SAVE THESE HEADERS***. Resent-Sender: [log in to unmask] Precedence: list X-Loop: [log in to unmask] X-Mailing-List: <[log in to unmask]> archive/latest/9476 Resent-From: [log in to unmask] Resent-Message-ID: <"TckWQ3.0.gPD.YNZvo"@ipc> X-Mailer: Microsoft Mail V3.0 Encoding: 23 TEXT Message-ID: <[log in to unmask]> Date: Wed, 22 Jan 97 10:53:00 EST Subject: GEN: Lead Coplanarity Spec?? To: technet <[log in to unmask]> From: "Rajan, Sanjay" <[log in to unmask]> Old-Return-Path: <[log in to unmask]> Resent-Sender: [log in to unmask] Received: by ipc.org (Smail3.1.28.1 #2) id m0vn4qs-0000ZlC; Wed, 22 Jan 97 09:44 CST Resent-Date: Wed, 22 Jan 1997 15:48:00 -0800 Received: from ipc.org by simon.ipc.org via SMTP (940816.SGI.8.6.9/940406.SGI) id PAA08552; Wed, 22 Jan 1997 15:48:00 -0800 Received: from simon.ipc.org by marceau.fm.intel.com (8.8.4/10.0i); Wed, 22 Jan 1997 22:04:46 GMT Received: from marceau.fm.intel.com (marceau.fm.intel.com [132.233.247.8]) by fm mail.fm.intel.com (8.7.4/8.7.3) with ESMTP id OAA21046; Wed, 22 Jan 1997 14:02:2 5 -0800 (PST) Return-Path: [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************