Good Morning TechNet! To my knowledge there is not a specification requirement for the "thickness" of the tinning of gold plated components. The MIL STD 2000 and the JSTD-001 specifications were/are focused on the removal of the gold rather than getting a specific tinned thickness and I would focus more on that aspect also. Both specifications endorse either a double dip (two solder pots) emmersion or the use of a flowing solder wave as proven methods for removal of the gold plating and replacing it with tin/lead. JSTD 001 goes further in that it promotes the development of documented data showing that your method of removing the gold is sufficient for allowing reliable assembly operations. One industry number that has been suggested is 60 microinches of tin/lead on the leads is sufficient to insure solderability (I think this number may have come out of the old WS6536 specification). Keeping 60 microiches of tin/lead on the corners of square leads can sometimes be a problem. I suggest working with your vendors to evaluate how they propose to remove the gold and either through microsection or electron microscopy document that the gold is gone. How much solder you want to have left on the leads will depend on how fast your process consumes the components. Good Luck. Dave Hillman Rockwell Collins [log in to unmask] ______________________________ Reply Separator _________________________________ Subject: ASSY: Pre-tinning of Gold Leads Author: [log in to unmask] at ccmgw1 Date: 1/14/97 3:13 PM Technetters We use a lot of components that come with gold plated leads (gull wing, J-leaded, castellations..). We are currently asking our vendors to pre-tin these leads if possible and one such vendor wants to know the exact mil-spec that he can look up to know the thickess of the tinning that is required. Can anyone point me to the exact document that spits out recommended tinning thicknesses based on the thickness of the gold on the lead?? Thank you ________________________________________________ Sanjay Rajan RF Communications Division Harris Corporation Product Design Engineering 1680 University Avenue Phone: (716) 242-3923 Rochester, NY 14610 Fax: (716) 242-3174 ________________________________________________ *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * *************************************************************************** *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************