Regarding Thad McMillan's request for information on the ever-lively topic of Reflow of Through-hole (ROT) also known as Paste In Pin, Pin In Paste, Intrusive Soldering, Single Center Reflow, and other terms, Joe Belmonte (MPM) and I did an article in the September, 1996 edition of Circuits Assembly Magazine on the subject. It was based upon Joe's experiences at Motorola (Codex) and mine at GSS/Array as well as work I've done with clients in this specific area. We gave specific formulas that we have used and I recommend taking a look at it if this is an area of interest to you. I received a lot of feedback on the article. A number of folks have done reliability work including generating pull and shear strength data (specifically, Tektronics shared some experiences with me). For most applications, even if the fillet is convex, there is usually more than ample bonding area. We are used to the mountain of solder for through-hole from traditional means of soldering them (wave and hand). All of that solder is likely unnecessary. Even if there is a certain degree of voiding within the barrel. However, all applications are not the same and I recommend that you know what your requirements are and what environment the product will live in before you undertake ROT. Phil Zarrow, ITM Inc. *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************