Address, I asked this question once before but probably didn't send correctly. Is there anyone out there currently assembling chip resistors underneath a J-leaded PLCC-44? IPC-SM-782 does not spec the contact lead to package distance. I may be placing any of following 0603, 0805 and 0402 under the PLCC-44. Concerns I have: Without running a Thermal Profile with thermocouples will there be enough heat to reflow the underlying chip or will the PLCC-44 device rob it of heat? I'm I correct to assume the chip may crack should the pressure from the head be too strong and obviously if there is enough room under the device. The assembler does not have a variable pressure control for pick and place heads. And again is it feasible. I have other options but none that are as efficient as the one described. Please advise, John Gulley - QA *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************