Fred, The following is my opinion on the term resin recession. IMO resin recession is a poor term. It infers that the resin has backed away fron the hole wall. When going past the Tg temperature (130 degrees C in most cases), the board material becomes very soft. As the temperature rises, the material becomes more flexible. At soldering temperatures, it becomes extremely rubbery. When you float the sample for testing, the temperature is generally 500 F. The epoxy in the laminate material, adjacent to the copper hole wall, becomes extremely hot. IMO the area you are calling resin recession, is nothing more than a heavy concentration of epoxy caused by the extreme heat next to the hole wall. Remember, with two solder floats, this is the third time the board saw extreme heat due to a necessary HASL operation. I beleive that the only problem here is that you can no longer see the glass fibers adjacent to the hole wall due to the epoxy becoming semi-molten during the extreme heat requirements. I believe that the hole structure has not changed but only the semi-molten epoxy changed the appearance. You may see this same problem after the HASL process only, and without your solder float test. I'm sure that you would not have seen the same problem BEFORE the board ever experienced any heat. IMO there is absolutely nothing wrong with resin recession! Regards, Norm Einarson Printed Circuit Technology