Subject: Re: FAB: Resist Lamination Re: Note from you attached below How do I respond to this guy?? This is exactly the reason why we invented our own and have sold quite a few units..........we can help him out.......Mike ------------------------------- Referenced Note --------------------------- Date: 31 July 96, 06:53:31 EDT From: AYOTTE at ENDVM1 To: MCUMMING, ANDEL Subject: Re: FAB: Resist Lamination Re: Note from SMTP2 at IINUS1 fyi... ------------------------------- Referenced Note --------------------------- Received: from simon.ipc.org by vnet.IBM.COM (IBM VM SMTP V2R3) with TCP; Tue, 30 Jul 96 22:36:26 EDT Received: from ipc.org by simon.ipc.org via SMTP (940816.SGI.8.6.9/940406.SGI) id VAA04356; Tue, 30 Jul 1996 21:33:26 -0700 Resent-Date: Tue, 30 Jul 1996 21:33:26 -0700 Received: by ipc.org (Smail3.1.28.1 #2) id m0ulQtc-0000LUC; Tue, 30 Jul 96 21:20 CDT Resent-Sender: [log in to unmask] Old-Return-Path: <[log in to unmask]> Message-ID: <[log in to unmask]> Date: Tue, 30 Jul 1996 22:27:53 -0700 From: JOHN GIBSON <[log in to unmask]> Organization: J.A.G. IMAGING SYSTEMS X-Mailer: Mozilla 2.01 (Win95; U) MIME-Version: 1.0 To: John Gully <[log in to unmask]> CC: Technet <[log in to unmask]> Subject: Re: FAB: Resist Lamination References: <[log in to unmask]> Content-Type: text/plain; charset=us-ascii Content-Transfer-Encoding: 7bit Resent-Message-ID: <"U3LSG1.0.qXC.ZBi_n"@ipc> Resent-From: [log in to unmask] X-Mailing-List: <[log in to unmask]> archive/latest/5453 X-Loop: [log in to unmask] Precedence: list Resent-Sender: [log in to unmask] John Gully wrote: > > Address, > > Has anyone identified the true benefits for using WET resist > lamination over DRY (specific to the Dupont HRL-24 Hot Roll Laminator)? > I am already familiar with most of the pros and cons of both. > In working with our operators daily, we run WET lamination for > inner layers and DRY lamination for external layers. Seldom > does the wall mounted pressure and/or water valves work for > WET lamination for inner layers. On several occasions I have > found the WET method (hardware) to not work. > > I pose this same question with our vendors on what they see > at other shops they frequent. WET is always the loser. > > Since the exit temperature is critical to resist adhesion, I > figure the wetting process would hinder the surface temperature > from peaking. Is this true? > > If the nominal roller temperature is 120 degrees C what is the > recommended surface exit temperature? > > Please advise... > > John Gulley > > > > *************************************************************************** > * TechNet mail list is provided as a service by IPC using SmartList v3.05 * > *************************************************************************** > * To unsubscribe from this list at any time, send a message to: * > * [log in to unmask] with <subject: unsubscribe> and no text. * > *************************************************************************** John In response to your question on exit temps. I find the best results exit are achieved when the exit temp is warm to the touch.I know it does not sound very technical but I find it is the best way to laminate different types of thicknesses and materials. Keep your roller temp consistent and adjust your roller speed to ensure that the exit temp of your material is warm. material temp warm to cool ? slow down rollers material hot? speed up rollers -when I run for example .005 1/2 1/2 core material I use 2 people at a fairly fast roll speed -When I run a .093 backplane my roller speed is very slow easy for one operator Hope it helps John Gibson J.A.G. Imaging Systems *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************