One approach is to fill the hole with a temporary solder mask forced into the holes from the back side. This works on thinner boards by completely filling the hole but as the boards get thicker it does not go all the way through. Even so the volume remaining unfilled is predictable. ---------- From: [log in to unmask] To: [log in to unmask] Subject: ASM: SMT pads with vias. Date: Friday, June 07, 1996 6:25PM We are manufacturing military multilayer circuit cards with via holes in the smt pads, unless they are filled prior to mounting components, they affect the reflow process in an uncontrolled manner, producing random solder joints with insufficient solder volume. Is there a know process for either plating shut (not my choice)or filling the vias during the pwb fab process, of is there a known process for controlling the travel of solder down unfilled vias that remain in the compontent pads such that there is less variability in the finished solder joint volume? Thanks, [log in to unmask] Neal Preimesberger at Hughes Missile System Co. Tucson AZ.