De: Coderre - JCCODERR BRMVM1 *************************************************************** CLASSIFICATION NON-CLASSIFIE ( ) CONFIDENTIEL ( ) Objet: BGA finish Typically we talk of 5-10 microinches of gold. This is a self-limiting process with the upper limit being in this range. The 3-5 is indeed too tight and may represent a given immersion gold process. As for wire bonding, the boards would typically go through an additionnal "true electroless" gold process, depositing a minimum of 20 microinches. Two different gold thicknesses means one needs a compatible masking process which we are presently introducing for some of our customers. Merci/Regards Directeur Ingenierie MLC / MLC ENG. MGR Dept 881/23 BRMT (tel. 514-534-6591, US tieline 552) INTERNET ADDRESS [log in to unmask] *** Forwarding note from SMTP2 --IINUS1 05/09/96 12:25 ***