De: Coderre - JCCODERR BRMVM1 *************************************************************** CLASSIFICATION NON-CLASSIFIE ( ) CONFIDENTIEL ( ) Objet: Skip plating Reply: <Reply> As an electroless nickel/gold shop, we have seen this condition in some cases. The suggested analytical approach is as follows: - good visual inspection at high magnification - SEM + EDX analysis - Auger analysis Please check to see if the defect is repetitive (it sometimes is). If so, use these techniques prior to plating. Hope this helps... Jacques Coderre IBM Microelectronics Plating engineering manager [log in to unmask] ************************************************************************* Received: from simon.ipc.org by vnet.IBM.COM (IBM VM SMTP V2R3) with TCP; Thu, 25 Apr 96 09:20:35 EDT >From ipc.org by simon.ipc.org via SMTP (940816.SGI.8.6.9/940406.SGI) id IAA06189; Thu, 25 Apr 1996 08:21:03 -0700 Resent-Date: Thu, 25 Apr 1996 08:21:03 -0700 Received: by ipc.org (Smail3.1.28.1 #2) id m0uCQbo-00007YC; Thu, 25 Apr 96 07:57 CDT Resent-Sender: [log in to unmask] Old-Return-Path: <[log in to unmask]> Date: Thu, 25 Apr 1996 21:00:05 +0800 (MYT) Message-Id: <[log in to unmask]> X-Sender: [log in to unmask] X-Mailer: Windows Eudora Pro Version 2.1.2 Mime-Version: 1.0 Content-Type: text/plain; charset="us-ascii" To: [log in to unmask] From: tonghh <[log in to unmask]> Subject: Exposed copper after electroless nickel gold Resent-Message-ID: <"aFnt03.0._u5.gQtVn"@ipc> Resent-From: [log in to unmask] X-Mailing-List: <[log in to unmask]> archive/latest/3638 X-Loop: [log in to unmask] Precedence: list Resent-Sender: [log in to unmask] Recently we encounter exposed copper problem after electroless nickel gold process , we wish to know if there any way to determine the stubborn film on top of the copper that prevent the plating to take place . We understand that soldermask on pad or poor rinsing after final development could give rise to such problem . Such problem of soldermask on pad could be easily found after HAL but cases of minor soldermask on pad could not be detected in HAL . Please advise . Merci/Regards Directeur Ingenierie MLC / MLC ENG. MGR Dept 881/23 BRMT (tel. 514-534-6591, US tieline 552) INTERNET ADDRESS [log in to unmask]