INTERNATIONAL CONFERENCE ON ELECTRONIC ASSEMBLY: MATERIALS AND PROCESS CHALLENGES ANNOUNCED The International Conference on Electronic Assembly: Materials and Process Challenges, cosponsored by the Institute for Interconnecting and Packaging Electronic Circuits (IPC) and the Georgia Institute of Technology has been announced. The conference will be held May 29-31, 1996, in Atlanta, Georgia, at Georgia Tech. This conference is an outgrowth and expansion of the International Conference on Soldering Flux and Pastes, which was last held in 1994 at Georgia Tech and attracted over 150 electronics assembly experts and practitioners from North America, Europe, and Asia. "New materials and processes must be developed to meet the challenge of ball grid array and direct chip attach," says Dr. Laura Turbini, Georgia Institute of Technology and Conference Chairman. "The process engineers who, in the past, were challenged by solder paste deposition for fine pitch attachment processes, are now dealing with BGA and planning for direct chip attach with polymer underfill." The program committee for this prestigious event also includes Alvin F. Schneider, Alpha Metals; Kathi Johnson, Hexacon Electric; Dr. Wallace Rubin, International Consultant; Tom Fujikawa, Malcolm Instruments; and David Bergman, IPC. For more information, e-mail me at [log in to unmask] and I can e-mail you the program and the registration information. An FYI - I thought some of u might be interested in this Ron Frye