Hello Harlan - Bill Barthel, Electronic Assembly Corp (aka Plexus) and Tom Gervascio, Group Technologies published papers in the 1994 SMI Proceedings on paste in hole work. Both do quite of bit of solder paste reflow of thru hole connectors on predominately SMT assemblies. I would be interested in your current process. I have tried the paste in hole on some PWA's with minor success. Dave Hillman Rockwell CACD [log in to unmask] ______________________________ Reply Separator _________________________________ Subject: ASSY: Solderpaste In Through-Hole Process Author: [log in to unmask] at ccmgw1 Date: 4/10/96 10:13 PM Our designs are utilizing Surface Mount Components more each day. Due to the type of product we manufacture, we will continue to have several through-hole style components on each circuit card. The small amount of through-hole does not justify continuing Wave-Soldering. This year we have introduced an alternate process to our production floor. We are screening solder-paste over the through-hole components along with the SMD components and then reflowing the entire CCA. This process is not necessarily new to industry but new to our company. We have had both success and horror stories. The success stories have encouraged us to develop this process further with the intent of reducing or eliminating Wave-Soldering altogether. My question is: Are there any guidelines published surrounding this process or is anyone else using or developing this process? Most of our information that we used to get this far came from one of our screen suppliers. IF anyone is interested in our current process please let me know. Thanks - Harlan [log in to unmask]