Heurikon is a company that designs and mfg single board computers. We have questions in relation to cleaning flux from under a BGA and how can we establish a solid test process for assurance of not only a good functional board but a reliable solder joint on the BGA. Heurikon presently uses a water based flux. Do we have to go to a No Clean process?? Is there small test equipment that will allow us to use JTAG within the BGA. Does anyone out there have any answer to these question or experience in these issues?? Thanks