Reply to: RE>Re[2]: Electroless Ni/Immersion A Thad: Based on a reliability report generated by HP: If the gold content is less than 2% of the resultant solder joint volume, no appreciable solder embrittlement will occur. Therefore, the VOLUME of gold on ANY pad must be less than 2% of the resultant solder joint VOLUME, or ~1% of the VOLUME of solder paste applied to that pad. (e.g. if 0.005" solder paste is applied, gold thickness should be < 50 micro-inches.) Bill Fabry Truevision, Inc. -------------------------------------- Date: 3/1/96 5:42 AM To: Bill Fabry From: Thad McMillan I have a follow up question, what is the mininum associated gold thicknesses for gold on areas to be soldered. In Table 3-2 it only states .8 um (Max). Thanks, [log in to unmask] ______________________________ Reply Separator _________________________________ Subject: Re: Electroless Ni/Immersion Au Author: [log in to unmask] at Dell_UNIX Date: 2/28/96 5:18 AM IPC-6012, Qualification and Performance Specification for Rigid Printed Boards, identifies the following minimums: Class 1 Class 2 Class 3 Nickel to act as a barrier for copper-tin 1.0 um 1.3 um 1.3 um compounds Gold for edge-board connectors and areas not 0.8 um 0.8 um 1.3 um to be soldered um = micrometers It should be noted that this document is in proposal stage. These numbers are subject to revision during the development of the document. This document is to replace IPC-RB-276. **************************************** Lisa M. Williams Technical Staff IPC 2215 Sanders Road Northbrook, IL 60062 phone: (847) 509-9700 x 379 fax: (847) 509-9798 email: [log in to unmask] **************************************** On Mon, 26 Feb 1996 [log in to unmask] wrote: > A question, > > Are there any reports or IPC data which details the minimum amounts of > electroless nickel needed to provide a sufficient barrier to copper migration > and the minimum amounts immersion gold needed to provide sufficient plating > finish. > > Concerns are solderability failures and corrosion of components. > > Annmarie Rainford > Merix Corporation > Forest Grove, Oregon 97116 > 503-359-9300 x74426 > > ------------------ RFC822 Header Follows ------------------ Received: by rainbow.rasterops.com with SMTP;1 Mar 1996 05:42:33 -0800 Received: from ipc.org by simon.ipc.org via SMTP (940816.SGI.8.6.9/940406.SGI) id FAA29383; Fri, 1 Mar 1996 05:19:19 -0800 Resent-Date: Fri, 1 Mar 1996 05:19:19 -0800 Received: by ipc.org (Smail3.1.28.1 #2) id m0tsUEf-00006AC; Fri, 1 Mar 96 06:47 CST Old-Return-Path: <[log in to unmask]> Date: Wed, 28 Feb 96 12:01:54 CST From: "Thad McMillan" <[log in to unmask]> Encoding: 64 Text Message-Id: <[log in to unmask]> To: [log in to unmask] Subject: Re[2]: Electroless Ni/Immersion Au Resent-Message-ID: <"PuQ3b1.0.n68.07lDn"@ipc> Resent-From: [log in to unmask] X-Mailing-List: <[log in to unmask]> archive/latest/2955 X-Loop: [log in to unmask] Precedence: list Resent-Sender: [log in to unmask]