Hai to Experts on SMT process, I am looking for whether a standard exists for selection of stencil thickness. I have been told by my stencil manuf that the apertures are shrunk down from pad size (Gerber data) and stencil thickness is taken based on the industrial norm based on other users of stencils. It look to me rather trivial. Though ind norms may work for most of the boards but they may not work for few different boards---thus, there must be norm on min and max amount of solder /solder paste. I am looking for norms on the solder volume which can be used for selection/ verifying the stencil apertures and thickness. *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************