FINAL REMINDER CALL FOR PAPERS--We still have room for a few good technical non-commercial presentations at The 21st Annual Electronics Manufacturing Seminar in Ridgecrest, California on 19-21 February 1997. Suggested subject areas) are: Advanced Assembly Techniques (COB/EPT/BGA/Flip Chip), Acquisition Reform, Automated Inspection, Cleaning Processes, Components (Mil Spec/Commercial), Environmental Issues, Non-Governmental Standards/ Commercial Standards for Process Control, Printed Wiring Board/ Assembly Materials (Fluxes/Solder/Adhesives/Conformal Coatings), Material Qualification and Use, Reliability Issues, Solderability, Solderability Processes. Solder Alternatives, and Training Issues.Two presentation formats will be utilized -- Technical Paper , 40 minutes in length and Technical Brief - 5 to 10 minute.If you are interested, call Mel Parrish, MTTC, or Jerry Maurice, NAWCWD ar 619-446-5571 now. Regards Doug Whitnell *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************