We have separate geometries for those chip parts that are to be waved instead of vapor phased. It has worked well. ______________________________ Reply Separator _________________________________ Subject: RE: ASSY: 0402 chip placement (#570929) Author: [log in to unmask] at SMTPpost1 Date: 10/9/96 3:55 PM You might discover an increase in tombstoning components attributed to the amount of surface tension of the reflowed solder versus the relative weight of the component. Often times one of the component pads may reflow a split second prior to the other pad, and the resulting surface tensions may shift/ and or tilt the component up. These problems can be worked out by finding the proper combination of reflow process, and component pad geometry. Some manufacturers seem to use component pads that are reduced at the component ends to help reduce the outward surface tension. Good luck. Steve A *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************