---------------------------- Forwarded with Changes --------------------------- From: Steven Holzinger at Rogers-MCD Date: 2/19/96 8:21AM To: Marc Beulque at ROGERS-MEKTRON cc: Sheryl L. Dehning-Brown at Rogers-MCD cc: Rick Jansen at Rogers-MCD cc: Dick Traskos at Rogers-R&D cc: Andrew P Magee at Rogers-MCD Subject: Re: LOC Tape - Siemens Regensburg ------------------------------------------------------------------------------- Lead On Chip (LOC) Tape is use to position chips on lead frames prior to interconnecting and encapsulation. We're not familiar with the IPC documents specific to this application. What are the five moisture levels for LOC Tape? Any information would be appreciated. Andy Magee - Applications Engineer Rogers Corp - Circuit Materials Unit Tel: (602) 917-5237 Fax: (602) 917-5256 E-Mail: [log in to unmask] ______________________________ Reply Separator _________________________________ Subject: LOC Tape Author: Steven Holzinger at Rogers-MCD Date: 2/14/96 3:57 PM They are apparently testing every LOC tape known in order to make their choice, maybe within the next 2 or 3 weeks... We found that they referred to a spec or document from IPC which defines 5(?) moisture levels for tapes. We are trying to get a copy of the document from them; in the meantime, are you familiar with such a spec? They are saying that "everyone in the tape business" seems to be working to "level 3," except a few who are working to "level 1," the toughest requirement. Would appreciate hearing whatever you know of this. Thanks. -Steve