Tom, I agree that thermals are only necessary for solderability of thru-hole component leads. They keep the planes from drawing heat away from the leads and causing a "cold" solder joint. I've been using direct connections to inner planes for vias. Gary Fuller Edwards Systems Technology Sarasota, FL [log in to unmask] ______________________________ Reply Separator _________________________________ Subject: Re: Design (fwd) Author: [log in to unmask] at Internet2 Date: 09-17-96 08:46 This discussion brings up another point.... Does it make sense to use thermal connections on vias? Thermals were originally used on thru hole comps to increase solderability of the leads, but now that is not necessary for SMT. Is there any reason to use them for vias? I've been using direct connection to the inner planes. Tom Kavendek Lucent Technologies Murray Hill, N.J. [log in to unmask] **************************************************************************** * The mail list is provided as a service by IPC using SmartList v3.05 * **************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * **************************************************************************** **************************************************************************** * The mail list is provided as a service by IPC using SmartList v3.05 * **************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ****************************************************************************