Message-ID: <[log in to unmask]>
Date: Tue, 27 Aug 1996 13:50:55 -0700
From: Larry Waksman <[log in to unmask]>
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Subject: Re: Glue and Fine Pitch Devices
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Doug McKean wrote:
>
> We are currently having our board assembly house use a quick drying glue
> to secure a 30AWG wire to the pcb for a modification. We are finding
> the glue can cause electrical problems (not all the time) if it is
> in the leads of FINE PITCH surface mount devices. This is confirmed
> when the glue is removed. There is the telltale white residue on the
> glue indicating the glue is applied first and the accelerater applied
> second. Something I've done myself. It's my understanding that the
> accelerator should applied first and the glue second. There are no
> controlled impedence issues and comparativley low frequency of
> 1 to 32 MHz digital signals.
>
> 1. Has anyone had electrical problems with glue in the leads of
> fine pitch devices?
>
> 2. Can the glue be conductive for at least fine pitch devices?
>
> I've seen this glue used tons of times without this effect.
> Thanks in advance.
>
> Doug
> --
>
> *******************************************************
> Doug McKean
> [log in to unmask]
> -------------------------------------------------------
As Gregg Klawson mentioned in his reply, it seems that you have some
blooming of cyanoacrylate occurring. You can minimize/eliminate it by
speeding up the cure or using a low-blooming CA. You can speed things up
by pre-applying accelerator to the substrate and post-applying
accelerator to the adhesive dot. Increased humidity also helps.
Another option is to use a high viscosity, low intensity UV curing
adhesive to tack the wires.
Loctite has a full line of UV and low bloom CAs to help you with this.
You can reach Loctite at 1-800-LOCTITE.
Also, Gregg mentioned electromigration as a problem with surface moount
adhesives. Loctite also has surface mount adhesives that meet Bellcore
TR-NWT-000078 electromigration specs.
Good Luck,
Larry Waksman
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